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Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest
microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication".In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines ...
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2016; Volume 20, Number 4 . Eutectic bonding is an area of particular interest to photonics, microwave and RF electronics, because of the need for a clean,highly thermally efficient process, as well as for long-term reliability.
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Paroteq GmbH is an innovative developer of high quality handling and automation solutions from the area of micro assembly. We provide systems for flip chip assembly or die bonding.
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Technologies Inc builds integrated combined
spectroscopic ellipsometer and microspectrophotometers for thin film, MEMS, patterned sample measurements
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Multiple patterning (or multi-patterning) is a class of
technologies for manufacturing integrated circuits (ICs), developed for photolithography to enhance the feature density. It is expected to be necessary for the upcoming 10 nm and 7 nm node semiconductor processes and beyond. The premise is that a single lithographic exposure may not be enough to provide sufficient resolution.
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